When integrating the NVIDIA Jetson Orin into your product design — whether for AI vision, robotics, edge computing, or autonomous systems — one challenge becomes immediately clear: managing heat. These modules pack incredible processing power into a compact footprint, and with that comes significant thermal load.
To keep performance stable and avoid thermal throttling, selecting the right thermal interface material (TIM) is critical. But how much thermal conductivity do you actually need? And which materials from our lineup are ideal for this use?
Let’s break it down.
🔥 Understanding the Thermal Load of Jetson Orin
Depending on the model and configuration, the Jetson Orin module can draw anywhere from 15W to 60W of power — with most edge AI deployments using 20–40W modes. This heat must be efficiently transferred away from the processor to a heatsink or chassis to avoid performance drops or even hardware stress.
What matters most in this transfer?
✔️ Tight mechanical fit
✔️ High-quality contact
✔️ And most importantly: a TIM with sufficient thermal conductivity.
✅ The Recommended Thermal Conductivity for Jetson Orin
For reliable, stable cooling of Jetson Orin modules in real-world conditions, we recommend using a TIM with a thermal conductivity of at least 6.0 W/m·K.
This ensures:
- Efficient transfer of heat from the chip to the heatsink
- Minimal temperature rise at the interface
- Reduced risk of thermal throttling
- Support for compact enclosures where airflow may be limited
🧊 Which of Our Products Are a Perfect Fit?
Based on the thermal demands of Jetson Orin modules, here are the recommended materials from our portfolio:
1. Carbon-Based Thermal Pads (15–45 W/m·K)
Best Option for Maximum Performance
Ideal when you want the lowest possible thermal resistance. Offers ultra-high conductivity, and conforms well to uneven surfaces.
✔️ Use when you need top-tier performance in compact, high-load systems.
2. Silicone Thermal Pads (6.0–15.0 W/m·K)
Balanced and Flexible Solution
Soft, compressible, and easy to apply — these pads offer excellent gap filling and meet the minimum recommended conductivity for Jetson Orin.
✔️ Perfect for AI dev kits, robotics modules, and industrial designs.
3. Silicone-Free Thermal Pads (Up to 8.0 W/m·K)
For Sensitive or Clean Applications
If your design involves optical lenses, sensitive sensors, or needs to avoid silicone migration, these pads deliver the performance you need — without the risk.
✔️ A clean and compliant solution for medical, optical, or sealed systems.
4. Two-Component Thermal Gel (2K Putty) (Up to 8.0 W/m·K)
For Long-Term, Vibration-Resistant Designs
Mixes and cures into a soft elastomer that holds its shape. Excellent for mobile, automotive, or ruggedized systems using Orin modules.
✔️ Ideal when shock absorption and permanent thermal bonding are needed.
🛠 Application Tips
- Always ensure your TIM fully covers the SoC contact area on the Jetson Orin
- Avoid air gaps — even small ones dramatically reduce thermal performance
- Consider your mechanical stack-up: softness, thickness, and compression matter
- For high-power operation, combine good TIM with a properly designed heatsink or heat spreader
🧠 Summary: Your TIM Must Match the Power of Orin
Jetson Orin modules demand serious thermal performance. If you’re building with one, don’t guess — plan your thermal strategy early.
✅ Minimum target thermal conductivity: 6.0 W/m·K
✅ Choose from our Carbon, Silicone, Silicone-Free Pads or Curing Gel
✅ Match the TIM to your mechanical, environmental, and performance needs