Managing heat in compact embedded systems starts with choosing the right thermal interface material (TIM). Below is a curated list of the most widely used solutions and the recommended thermal conductivity for the TIM to ensure reliable heat transfer.
| Jetson Module | Recommended TIM Thermal Conductivity (W/m·K) |
|---|
| Jetson Nano (2GB) | ≥ 3.0 (Moderate-performance thermal pad) |
| Jetson Nano (4GB) | ≥ 3.0 (Moderate-performance thermal pad) |
| Jetson Nano Module (Production) | ≥ 3.0 (Moderate-performance thermal pad) |
| Jetson Nano Developer Kit | ≥ 3.0 (Moderate-performance thermal pad) |
| Jetson TX1 | ≥ 4.0 (Moderate-performance thermal pad) |
| Jetson TX2 | ≥ 4.0 (Moderate-performance thermal pad) |
| Jetson TX2 4GB | ≥ 4.0 (Moderate-performance thermal pad) |
| Jetson TX2 NX | ≥ 4.0 (Moderate-performance thermal pad) |
| Jetson TX2i (Industrial) | ≥ 4.0 (Moderate-performance thermal pad) |
| Jetson Xavier NX (8GB) | ≥ 6.0 (High-performance thermal pad) |
| Jetson Xavier NX (16GB) | ≥ 6.0 (High-performance thermal pad) |
| Jetson AGX Xavier (32GB) | ≥ 6.0 (High-performance thermal pad) |
| Jetson AGX Xavier Industrial | ≥ 6.0 (High-performance thermal pad) |
| Jetson Orin Nano (4GB) | ≥ 4.0 (Moderate-performance thermal pad) |
| Jetson Orin Nano (8GB) | ≥ 4.0 (Moderate-performance thermal pad) |
| Jetson Orin NX (8GB) | ≥ 6.0 (High-performance thermal pad) |
| Jetson Orin NX (16GB) | ≥ 6.0 (High-performance thermal pad) |
| Jetson AGX Orin (32GB) | ≥ 6.0 (High-performance thermal pad or gel) |
| Jetson AGX Orin (64GB) | ≥ 6.0 (High-performance thermal pad or gel) |
| Jetson AGX Orin Industrial | ≥ 6.0 (High-performance thermal pad or gel) |
| Rockchip SoC / SoM | Recommended TIM Thermal Conductivity (W/m·K) |
|---|
| RK1808 | ≥ 4.0 (Moderate-performance thermal pad) |
| RK3126 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3168 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3188 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3228 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3229 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3288 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3308 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3326 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3328 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3366 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3368 | ≥ 3.0 (Moderate-performance thermal pad) |
| RK3399 | ≥ 4.0 (Moderate-performance thermal pad) |
| RK3399K | ≥ 4.0 (Moderate-performance thermal pad) |
| RK3566 | ≥ 4.0 (Moderate-performance thermal pad) |
| RK3568 | ≥ 4.0 (Moderate-performance thermal pad) |
| RK3576 (new) | ≥ 5.0 (Moderate to high-performance pad) |
| RK3582 | ≥ 6.0 (High-performance thermal pad) |
| RK3588 | ≥ 6.0 (High-performance thermal pad) |
| RK3588S | ≥ 6.0 (High-performance thermal pad) |
| PX30 | ≥ 3.0 (Moderate-performance thermal pad) |
| PX3 | ≥ 3.0 (Moderate-performance thermal pad) |
| PX5 (RK3368 variant) | ≥ 3.0 (Moderate-performance thermal pad) |
| PX6 (RK3399 variant) | ≥ 4.0 (Moderate-performance thermal pad) |
| RV1103 | ≥ 3.0 (Moderate-performance thermal pad) |
| RV1106 | ≥ 3.0 (Moderate-performance thermal pad) |
| RV1108 | ≥ 3.0 (Moderate-performance thermal pad) |
| RV1126 | ≥ 3.0 (Moderate-performance thermal pad) |
| RV1109 | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi Model | Recommended TIM Thermal Conductivity (W/m·K) |
|---|
| Raspberry Pi 5 | ≥ 6.0 (High-performance thermal pad or gel) |
| Raspberry Pi 4 Model B (1–8GB) | ≥ 4.0 (Moderate-performance thermal pad) |
| Raspberry Pi 3 Model B / B+ | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi 2 Model B | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi 1 Model B / A+ | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi Zero / Zero W / 2 W | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi 400 | ≥ 4.0 (Moderate-performance thermal pad) |
| Raspberry Pi Compute Module 1 | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi Compute Module 3 | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi Compute Module 3+ | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi Compute Module 4 | ≥ 3.0 (Moderate-performance thermal pad) |
| Raspberry Pi Compute Module 4S | ≥ 4.0 (Moderate-performance thermal pad) |
| System-on-Module (SoM) | Recommended TIM Thermal Conductivity (W/m·K) |
|---|
| Google Coral SoM | ≥ 4.0 (Moderate-performance thermal pad) |
| Variscite DART-MX8M | ≥ 4.0 (Moderate-performance thermal pad) |
| Toradex Apalis iMX8 | ≥ 5.0 (Moderate-performance thermal pad) |
| Phytec phyCORE-AM57x | ≥ 3.0 (Moderate-performance thermal pad) |
| TechNexion PICO-IMX6 | ≥ 3.0 (Moderate-performance thermal pad) |
| CompuLab CL-SOM-AM57x | ≥ 3.0 (Moderate-performance thermal pad) |
| iWave iW-RainboW-G27M | ≥ 4.0 (Moderate-performance thermal pad) |
| Advantech ROM-5720 | ≥ 4.0 (Moderate-performance thermal pad) |
| Congatec conga-SMX8 | ≥ 5.0 (Moderate-performance thermal pad) |
| SolidRun HummingBoard Pulse | ≥ 4.0 (Moderate-performance thermal pad) |
| UDOO Neo | ≥ 3.0 (Moderate-performance thermal pad) |
| MYIR MYC-C335X | ≥ 3.0 (Moderate-performance thermal pad) |
| Intel Edison | ≥ 4.0 (Moderate-performance thermal pad) |
| Samsung ARTIK 710 | ≥ 4.0 (Moderate-performance thermal pad) |
| Arrow DragonBoard 410c | ≥ 4.0 (Moderate-performance thermal pad) |
| BeagleCore BCM1 | ≥ 3.0 (Moderate-performance thermal pad) |
| Kontron SMARC-sAMX8X | ≥ 4.0 (Moderate-performance thermal pad) |
| Aaeon COM-TGUC6 | ≥ 6.0 (High-performance thermal pad) |
| Advantech SOM-5899 | ≥ 6.0 (High-performance thermal pad) |
| NXP-Based SoM | Recommended TIM Thermal Conductivity (W/m·K) |
|---|
| NXP i.MX 6 (Solo/Dual/Quad) | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP i.MX 6UL / ULL | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP i.MX 6SoloX | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP i.MX 7 (Solo/Dual) | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP i.MX 8M (Quad/Dual) | ≥ 4.0 (Moderate-performance thermal pad) |
| NXP i.MX 8M Mini | ≥ 4.0 (Moderate-performance thermal pad) |
| NXP i.MX 8M Nano | ≥ 4.0 (Moderate-performance thermal pad) |
| NXP i.MX 8X | ≥ 4.0 (Moderate-performance thermal pad) |
| NXP i.MX 8QuadMax / 8QuadPlus | ≥ 5.0 (Moderate-performance thermal pad) |
| NXP i.MX 93 | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP i.MX RT1170 (crossover MCU) | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP i.MX RT1060 / RT1050 | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP i.MX RT1020 / RT1010 | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP Layerscape LS1012A | ≥ 3.0 (Moderate-performance thermal pad) |
| NXP Layerscape LS1028A | ≥ 4.0 (Moderate-performance thermal pad) |
| NXP Layerscape LS1043A | ≥ 4.0 (Moderate-performance thermal pad) |
| NXP Layerscape LS1046A | ≥ 4.0 (Moderate-performance thermal pad) |
| NXP Layerscape LS1088A | ≥ 5.0 (Moderate-performance thermal pad) |
| NXP Layerscape LX2160A | ≥ 6.0 (High-performance thermal pad) |
| NXP QorIQ P1022 / T1022 | ≥ 4.0 (Moderate-performance thermal pad) |