Smart Thermal Solutions for Powerful Performance
From thermal pads to high-performance pastes, discover next-gen cooling.
🔥 Made for Demanding Systems
Heat builds up. We help move it out.
⚙️ Born for Performance
Whether you're designing edge AI devices, automotive control units, or industrial robotics, our thermal materials are engineered to keep critical components within optimal temperatures—without compromise.
✅ High thermal conductivity across product lines
✅ Customizable thickness, shape, and form
✅ Compatible with automated dispensing & assembly
♻️ RoHS, REACH, and halogen-free compliant
🎲 Kookool Thermal Pad Advisor
🎲 Kookool Thermal Pad Advisor
Silicone Foam Pad
Silicone foam pads offer excellent sealing, cushioning, and thermal insulation. They're lightweight, flame-retardant (UL94 V-0), resistant to heat, UV, and moisture. Perfect for EVs, lighting, HVAC, and electrical components. Ideal for protecting sensitive parts and ensuring long-term reliability.
Carbon Fiber Thermal Pad
High-performance thermal pads with very high thermal conductivity (15–45 W/m·K) improve heat transfer and protect components from overheating. Their softness allows them to conform to uneven surfaces, while natural tackiness makes installation easy. Ideal for compact, high-power devices—while also meeting strict environmental standards.
Silicone-free thermal pads
Silicone-free thermal pads offer efficient heat transfer without the risks of silicone oil bleed or siloxane volatility. With thermal conductivities up to 8.0 W/m·K and thicknesses from 0.5 to 5.0 mm, they are self-adhesive, durable, and provide excellent electrical insulation. Ideal for data centers, automotive sensors, AI devices, and medical equipment, these pads ensure reliable performance while meeting stringent environmental and safety standards.
Silicone Thermal Pad
Silicone thermal pads are designed to improve heat dissipation in electronic devices by filling gaps between components and heat sinks. With thermal conductivities ranging from 1.5 to 15.0 W/m·K and thicknesses between 0.3 to 10.0 mm, they conform to uneven surfaces, reducing air gaps and enhancing thermal efficiency.
Phase change thermal pads
Phase change thermal pads are solid at room temperature for easy handling and become fluid at operating temperatures (45–55°C) to fill gaps between components and heat sinks. With thermal conductivities from 1.8 to 6.0 W/m·K, they reduce thermal impedance and improve heat transfer.
Thermal films
Thermal films are engineered to provide efficient heat dissipation and electrical insulation in electronic devices. Featuring thermal conductivities from 0.8 to 5.0 W/m·K and reinforced with materials like fiberglass or polyimide, these films offer high mechanical strength and can be customized to specific shapes.
Silicone-free thermal gel
Silicone-free thermal gels provide efficient heat dissipation without the risks of silicone oil migration or siloxane volatility. With thermal conductivities from 1.0 to 3.0 W/m·K, these non-curing, single-component gels offer excellent wetting, high compressibility, and are easy to apply.
Thermal putty aka thermal gel
Thermal putty (thermal gel) is a non-curing, highly compressible thermal interface material designed for efficient heat transfer in electronic devices. With thermal conductivities ranging from 2.0 to 10.0 W/m·K, it conforms to complex surfaces, reducing thermal resistance and minimizing assembly stress. Its excellent wet-out properties and compatibility with automated dispensing make it ideal for applications such as CPUs, GPUs, PSUs, LED modules, and ECUs, enhancing thermal management and device reliability.
Two-component thermal putty
Two-component thermal putty is a curable thermal interface material that, upon mixing, forms a soft, elastic elastomer. With thermal conductivities from 2.0 to 8.0 W/m·K, it provides efficient heat transfer and shock absorption. Post-curing, it maintains its thickness and flexibility, accommodating component movement. Ideal for applications such as CPUs, GPUs, PSUs, LED modules, and ECUs, it ensures reliable thermal management while meeting stringent environmental and safety standards.
Thermal conductive adhesive
Thermal conductive adhesives provide strong mechanical bonding and efficient heat transfer in electronic devices. With thermal conductivities ranging from 1.0 to 2.0 W/m·K, they offer high bonding strength, stability, and compatibility with automated dispensing systems. Ideal for applications such as communication devices, PSUs, LED modules, and ECUs, these adhesives ensure reliable thermal management while meeting stringent environmental and safety standards.
SMT red glue
SMT red glue is a fast-curing epoxy adhesive designed for securing SMD components on PCBs. It offers strong adhesion, thermal stability, and excellent electrical insulation properties. Beyond its primary use in PCB assembly, it serves as an effective solution for IP protection by concealing sensitive chips. Ideal for applications requiring reliable component attachment and safeguarding of proprietary designs.
✅ Trusted by Engineers. Loved by Builders.
We don’t just move heat—we move expectations.
At Kookool, we back every product with uncompromising quality and a commitment to real-world results.
⭐️ 100% Customer Satisfaction Guarantee
📦 Fast, reliable shipping worldwide
🔄 Flexible solutions for prototyping & production
👩💻 Responsive technical support when you need it
🔍 Quality-tested, performance-certified materials
🛠️ Build Your Custom Thermal Solution
🎯 Because one-size-fits-all doesn’t apply to performance.
Whether you need a specific thickness, cutout pattern, thermal conductivity range—or you're working with delicate components that demand just the right compression—Kookool lets you design your own heat transfer material.
- 📏 Custom shape, size, and fit
- 🌡️ Targeted conductivity & hardness
- 🔩 Engineered for your real-world assembly
- 🔁 Repeatable, scalable, and fast to deliver