Silicone-Free Thermal Gel (Putty)
Silicone-Free Thermal Gel (Putty)
This type of material is a non-curing, highly conformable thermal interface gel designed to flow and fill even the smallest gaps between heat-generating components and heat sinks. Unlike pads or films, it requires no cutting or shaping — it’s applied as a gel-like putty that settles naturally into the shape of the application.
Because it is silicone-free, it eliminates concerns about silicone migration, oil bleeding, or contamination, making it perfect for sensitive environments such as optics, data storage, and medical electronics.
Key Features & Benefits:
- 🌡 Stable Thermal Conductivity
Offers consistent performance across a range of options, typically 1.0 to 3.0 W/m·K, making it suitable for low to medium thermal load environments. -
❌ Zero Silicone Content
Ideal for cleanroom and silicone-sensitive applications where outgassing or siloxane volatility must be avoided. -
🧽 Highly Conformable & Flowable
Fills gaps, irregular surfaces, and micro-voids that traditional pads can't reach — with no stress on components. -
🧪 Non-Curing, Reworkable
Remains soft and workable indefinitely, allowing for easy re-application, part rework, or maintenance. -
🎯 Precision Dispensing
Compatible with automated dispensing systems for high-volume, controlled manufacturing lines. -
⚡ Excellent Electrical Insulation
Prevents shorts while conducting heat — perfect for densely packed circuit boards. -
🌱 RoHS & REACH Compliant
Environmentally friendly and halogen-free, suitable for global compliance needs.
Common Applications:
- Data Center & Server Hardware
- Automotive ECUs & Sensors
- Power Supplies & Charging Systems
- LED Modules & Displays
- Medical & Optical Devices
Use a silicone-free thermal gel when you need soft, stress-free thermal contact in sensitive or precision electronics, especially where silicone migration or oil bleed cannot be tolerated. It’s ideal for both prototype flexibility and automated mass production, offering reworkability, clean performance, and high adaptability.


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